Engineering Selection Reference
Double-sided metal-core PCBs: double-sided insulated IMS board fabrication review
Double-sided insulated IMS board fabrication requires review against current fabrication drawings. For bare double-sided IMS driver boards, review aluminum-core clearances, insulating fill, and heat sources on both sides, and approve cross sections before quotation. Two-sided interconnections add hole processes and inspection; conventional FR4 through-hole methods do not transfer directly. Deliver dielectric thicknesses on both sides and hole microsections; this page's combination is a special engineering reference configuration.
Double-sided metal-core PCBs first require defining bare PCB prototyping or volume-fabrication scope. Please provide Gerber data, drill files, board outline, and layer stackup, material and process requirements, quantity, and fabrication acceptance requirements. Circuits on both sides and holes insulated from the metal core form a separate product, more complex than single-sided IMS
Why choose this structure for double-sided IMS board
Compare double-sided IMS when a power module actually needs circuits/components on both sides and heat spreading through the metal core. Each side of the aluminum core has insulation and 70µm circuit copper; clearance holes in the metal core insulate upper/lower electrical connections from the base, creating a separate product more complex than single-sided aluminum core.
Why does double-sided metal-core PCB fabrication cost more than single-sided?
Circuits and dielectric on both sides, metal-core clearances, insulation-filled through-holes, two-sided surface finishes, and separate insulation inspections add costs. This is a reference double-sided IMS combination; core clearances/finished holes require dedicated assessment rather than conventional double-sided FR4 pricing. Provide cross sections, heat sources on both sides, and interconnect holes first, distinguishing process validation from volume-fabrication quotations.
Quotation terms depend on the approved files, quantity, material supply, tests and delivery requirements.
Prepare a structured RFQ or use the short inquiry form.
Enter the following items in one itemized quotation: specify cost units and tax/shipping basis, with separate columns for first orders and same-revision repeat orders. The table is a procurement breakdown method, not a ready-made price list; reference specifications require approval against current fabrication drawings.
| Quotation items and pricing boundaries | Configuration inputs to confirm | Repeat orders and revision changes |
|---|---|---|
| Materials/fabrication, quoted per batch or accepted board | 5052 aluminum core+TCLAD HPL-06706 insulating dielectric on both sides (original reference combination, not a manufacturer standard stackup); 2 circuit copper layers with aluminum core centered; finished circuit copper reference target 70µm on both sides; define starting foil and plating allowance after insulated-hole process review | Recurs on repeat orders; material, layer-order, or copper-weight changes require requotation |
| Holes and forming, per approved hole table | Metal-core clearance holes: reference Ø1.0mm core clearance+Ø0.40mm finished insulated through-hole; feasibility requires dedicated assessment | Repeat orders follow same-revision fabrication; check processes before changing double-sided IMS interlayer connections |
| Surface finish/packaging, noting areas and batches | ENIG; manage assembly-pad flatness separately on both sides | Incurred by actual batch; confirm packaging, storage conditions, and surface-finish substitutions separately |
| Engineering/tooling preparation, identifying one-time or per-batch charges | Double-sided IMS interlayer connections: specify whether connections between sides pass through holes and how they are insulated from the aluminum core. | Verify file revisions, ownership, and storage condition before reusing old tooling; do not assume reuse is free |
| Structural/special inspections, identifying coupons, hole groups, or samples | Approve cross sections and hole structures before agreeing on microsection locations; do not directly apply conventional FR4 through-hole approaches. Retain dielectric grades/thicknesses on both sides and insulation-test definitions. | List initial prototype validation and per-batch sampling separately; quote per-board requirements separately rather than assuming everything is completed once |
| Delivery scope, reports, and accepted quantity | Bare double-sided IMS PCB, metal-core clearance-hole/insulating-material drawings, and two-sided dielectric-thickness and hole-microsection records; agreed insulation/thermal measurement data. | Retain revision links and batch records on repeat orders; list component assembly, firmware, and complete-unit testing separately |
When should double-sided IMS or single-sided aluminum-core PCBs be selected?
Compare double-sided IMS when components and electrical interconnections are actually needed on both sides; a single-sided structure is more direct for LEDs or power devices on one side only. Components on both sides may obstruct cooling mounting surfaces, so check assembly sequence and thermal paths first. Choose based on the necessity of two-sided functions rather than adding insulated-hole risks for layer count alone.
| Comparison Dimension | Double-sided metal-core PCB fabrication | Aluminum-core PCB fabrication for automotive electric drives |
|---|---|---|
| Material and Grade | 5052 aluminum core+TCLAD HPL-06706 insulating dielectric on both sides (original reference combination, not a manufacturer standard stackup) | Historical TG150 metal-core material, grade unspecified; reference 5052 aluminum base+thermally conductive insulation |
| Layer Count and Structure | 2 layer circuit copper, aluminum core centered | 1 Layer Copper Aluminum Substrate |
| Hole Structure and Dimensions | Metal-core clearance holes: reference Ø1.0mm core clearance+Ø0.40mm finished insulated through-hole; feasibility requires dedicated assessment | NPTH Ø3.20mm mounting-hole target; no conductive holes through the aluminum base |
| Application | Double-sided power drives; compact motor-drive thermal interface boards | Automotive electric-drive thermal paths; bare power-drive thermal boards |
How can through-holes avoid shorting to an aluminum core?
Review reference core clearances and finished holes as a combination, considering insulating fill, drill registration, and hole walls. Conventional FR4 PTH rules cannot be applied directly through a metal core. Inspect first articles with microsections and independent circuit-to-core insulation tests on both sides, then determine the hole approach suitable for this order.
| Decision Sequence | Required project inputs | Agreed records and deliverables |
|---|---|---|
| 1. Define application and scope | Specify whether connections between sides pass through holes and how they are insulated from the aluminum core. | Approve cross sections and hole structures before agreeing on microsection locations; do not directly apply conventional FR4 through-hole approaches. |
| 2. Confirm structural requirements | Provide upper/lower component power dissipation and mounting surfaces to determine whether both sides use identical dielectrics. | Retain dielectric grades/thicknesses on both sides and insulation-test definitions. |
| 3. Align nets with fabrication targets | No controlled impedance for power paths; validate insulation to the metal core separately on both sides | Provide target nets, layer pairs, and validation scope; review together with metal-core clearance holes: reference Ø1.0mm core clearance+Ø0.40mm finished insulated through-hole, with dedicated feasibility assessment |
| 4. Confirm quotation and release revision | 5052 aluminum core+TCLAD HPL-06706 insulating dielectric on both sides (original reference combination, not a manufacturer standard stackup); 2.00mm reference target; ENIG; manage assembly-pad flatness separately on both sides | Request quotations using material/pattern/inspection lists at the same revision; list unapproved substitutions as separate alternatives rather than including them in the baseline quotation |
Double-sided IMS board manufacturing specifications
| Specification Items | Reference configuration or target |
|---|---|
| Material and Grade | 5052 aluminum core+TCLAD HPL-06706 insulating dielectric on both sides (original reference combination, not a manufacturer standard stackup) |
| Layer Count and Structure | 2 layer circuit copper, aluminum core centered |
| Total Board Thickness | 2.00mm reference target |
| Dielectric thickness and interlayer relationship | HPL-06706 nominal 152µm on each side; dedicated assessment of finished lamination thickness/insulated holes |
| Base Copper and Finished Copper | Finished circuit copper reference target 70µm on both sides; define starting foil and plating allowance after insulated-hole process review |
| Hole Structure and Dimensions | Metal-core clearance holes: reference Ø1.0mm core clearance+Ø0.40mm finished insulated through-hole; feasibility requires dedicated assessment |
| Trace Width and Spacing | 0.30/0.30mm reference design |
| Impedance Target and Measurement Methods | No controlled impedance for power paths; validate insulation to the metal core separately on both sides |
| Surface Finish | ENIG; manage assembly-pad flatness separately on both sides |
| Original Material Specifications | HPL-06706: nominal dielectric 152µm; HPL thermal conductivity 3.0W/(m·K), manufacturer ASTM D5470 value, not a double-sided finished-board guarantee |
| Application | Double-sided power drives; compact motor-drive thermal interface boards |
| Deliverables | Bare double-sided IMS PCB, metal-core clearance-hole/insulating-material drawings, and two-sided dielectric-thickness and hole-microsection records; agreed insulation/thermal measurement data. |
Double-sided IMS board layer stackup and via structure
The following shows functional layer order/material structure for this reference configuration, not a production stackup drawing; do not infer thickness from graphic proportions. Match copper-layer numbering to via layer pairs item by item in approved fabrication files.
| Top to Bottom | Layer Responsibilities/Structure |
|---|---|
| Structure 1 | Top Trace Copper |
| Structure 2 | Upper insulating dielectric HPL-06706 |
| Structure 3 | Aluminum core with insulated clearance holes |
| Structure 4 | Lower insulating dielectric HPL-06706 |
| Structure 5 | Bottom Trace Copper |
Hole structure: metal-core clearance holes: reference Ø1.0mm core clearance+Ø0.40mm finished insulated through-hole; feasibility requires dedicated assessment
HPL-06706 material and dielectric thicknesses on both sides
HPL-06706 nominal 152µm dielectric and 3.0W/(m·K) are manufacturer material data; thermal conductivity uses ASTM D5470. Confirm finished-board dielectric thickness, insulation tests, and installed thermal interfaces separately. Include heatsink contact surfaces and material revisions with RFQs so thermal testing matches actual assembly conditions.
Trade-offs between double-sided interconnect complexity and single-sided options
Double-sided IMS adds insulated through-holes and assembly difficulty, with higher cost/inspection requirements. Single-sided metal-core PCBs are more direct when two-sided connections are unnecessary. Reference Ø1.0mm core clearances/Ø0.40mm holes are not validated factory parameters; confirm the combination of insulating fill and drill registration.
Aluminum-core clearances, insulating fill, and hole coordinates: fabrication inspection
Check metal-core clearance regions, insulating fill, and mechanical-hole coordinates first; through-hole copper must not touch the metal core. Record dielectric thicknesses/thermal paths separately on both sides. Soldering and heatsink installation sequences must prevent components on one side from blocking cooling surfaces.
Two-sided insulation and clearance-hole microsections: acceptance items
Perform separate electrical/insulation validation between upper/lower nets and between each side's circuits and the metal core; inspect clearance-hole fill and hole walls in microsections. Measure hotspots on both sides and mounting-surface temperatures under actual power dissipation; single-sided IMS reports cannot cover double-sided structures.
Double-sided IMS board delivery scope
Applications: double-sided power drives; compact motor-drive thermal interface boards.
Bare double-sided IMS PCB, metal-core clearance-hole/insulating-material drawings, and two-sided dielectric-thickness and hole-microsection records; agreed insulation/thermal measurement data.
Metal-core cross sections, interlayer holes, and two-sided heat sources: RFQ inputs
Submit metal-core cross sections, interlayer holes, and two-sided heat sources to turn tabled design targets into inspectable fabrication drawings. The following inputs define pattern, material, or structural inspection scope; freeze the quotation revision with approved drawings.
| Project inputs required for review | Engineering decisions | Records/delivery as agreed in the order |
|---|---|---|
| Double-sided IMS interlayer connection | Specify whether connections between sides pass through holes and how they are insulated from the aluminum core. | Approve cross sections and hole structures before agreeing on microsection locations; do not directly apply conventional FR4 through-hole approaches. |
| Dual-Side Heat Source Configuration | Provide upper/lower component power dissipation and mounting surfaces to determine whether both sides use identical dielectrics. | Retain dielectric grades/thicknesses on both sides and insulation-test definitions. |
Double-sided metal-core PCB fabrication: pricing, selection, and procurement FAQ
Why does double-sided metal-core PCB fabrication cost more than single-sided?
The complete budget is materials/base fabrication + excluded profiling + specified inspection + taxes and shipping, divided by the delivered board quantity. A project-specific quotation requires review of the available files, quantity, materials, requested tests, delivery destination, taxes, shipping, and trade terms. These hypothetical amounts do not represent current market pricing for this product. No current unit prices are published here; request an itemized quotation for the approved scope.Review quotation inputs and scope.
When should double-sided IMS or single-sided aluminum-core PCBs be selected?
Evaluate double-sided IMS when components and interconnections are needed on both sides; single-sided construction is more direct for LEDs or power devices on one side only. Components may obstruct cooling mounting surfaces, so establish assembly sequence and thermal paths first rather than adding unnecessary insulated holes for more layers. Review the comparison
How can through-holes avoid shorting to an aluminum core?
Holes require metal-core clearances and insulating fill; inspect drill registration, hole walls, and fill together rather than applying conventional PTH directly through aluminum. Validate first samples with microsections and independent circuit-to-core insulation tests on both sides. Confirm the reference hole-diameter combination for this order. Review the comparison
Can both sides of double-sided IMS share a single-sided dielectric-withstand report?
No. Inspect each side's circuits relative to the metal core and relationships between upper/lower nets separately, matching actual electrodes and criteria to the structure. A single-sided material report does not establish validation of the reference double-sided finished board.
Can vias be added freely to double-sided metal-core boards?
Each through-core hole requires clearance and insulation space; added holes change mechanical and thermal structures. Prioritize necessary interconnections, and assess hole density and filling feasibility together with dedicated cross sections.
Does a double-sided IMS price include power-device assembly on both sides?
The current quotation covers bare PCBs; two-sided components and reflow/installation sequences belong to PCB assembly. For finished modules, separately list BOM, cooling structures, and two-sided thermal validation rather than quoting modules from bare PCB structure alone.
Can double-sided metal-core interlayer holes use conventional FR4 through-hole pricing?
Provide insulation cross sections between holes and the aluminum core, electrical connections between sides, and dielectric configurations before process assessment. Conventional FR4 through-holes lack the same metal-core insulation boundaries; equal hole diameters do not establish equally priced structures. Microsections should cover approved connections and insulation scope.
How can per-board and per-panel quotations for double-sided metal-core PCB fabrication be converted?
Review panels against two-sided dielectrics and metal-core clearance-hole cross sections, retaining insulation and hole-microsection locations on both sides. Do not apply conventional double-sided FR4 hole pricing. Specify deliverable finished-board quantity per panel, actual panel purchasing quantity, and individual-board/panel delivery state. Calculate fabrication cost per board by dividing actual panel fabrication cost by the corresponding accepted finished-board quantity; list preparation, special inspection, and packaging separately. Theoretical utilization cannot promise yield.
How should first-order one-time costs and repeat-order costs be separated for double-sided metal-core PCB fabrication?
For the first order, confirm documentation for double-sided IMS interlayer connections and heat-source configurations on both sides, identifying whether related engineering, tooling, or test preparation is charged once. Approve cross sections and hole structures before agreeing on microsection locations; do not directly apply conventional FR4 through-hole approaches. Before reusing tooling, verify files and ownership. This batch still incurs materials, fabrication, and approved inspections; separately list preparation that must be repeated after changes rather than relying on the old order total.
Can I get a double-sided metal-core PCB fabrication budget before IMS interlayer-connection information is complete?
Start with the application, board outline, quantity, and available drawings to obtain a budget identifying missing inputs. Formal review requires specifying whether connections between sides pass through holes and how they are insulated from the aluminum core. Corresponding deliverables require approving cross sections and hole structures before agreeing on microsection locations, without directly applying conventional FR4 through-hole approaches. Confirm fabrication/inspection quotations after these conditions are frozen. Initial inquiries need not include every file, but estimates do not imply coverage of undefined structures.
What must be reconfirmed when changing materials, hole tables, or mounting conditions on repeat orders for double-sided metal-core PCB fabrication?
Provide upper/lower component power dissipation and mounting surfaces to determine whether both sides use identical dielectrics. Retain dielectric grades/thicknesses on both sides and insulation-test definitions. Match each changed location against prior material/hole-table/mechanical files to determine whether drawings, processes, or measurements need updating. Retaining only the product name and layer count cannot establish identical repeat-order conditions.
When two double-sided metal-core PCB fabrication quotations specify the same material, which configurations still need checking?
First assess metal-core clearance/insulation-filled interlayer-hole feasibility, then compare upper/lower dielectrics and circuit-to-core insulation on both sides. The reference combination is not a validated standard process, and single-sided reports cannot cover a double-sided finished board.
Which reports should link to board IDs before double-sided metal-core PCB fabrication moves from prototypes to volume production?
Approve cross sections and hole structures before agreeing on microsection locations; do not directly apply conventional FR4 through-hole approaches. Retain dielectric grades/thicknesses on both sides and insulation-test definitions. Link material batches, approved fabrication files, and these inspection results to current prototype IDs; use the revision with issues closed for volume production. Reports for old coupons or patterns support comparison but cannot replace current fabrication inputs. Define separate scope for complete-unit items not yet covered.
If small-batch double-sided metal-core PCB unit prices fall, how can I determine whether total procurement costs really decrease?
For single-/double-sided IMS, first confirm whether two-sided components and interlayer holes are actually needed, then add two-sided assembly and insulation/thermal tests. Removing holes or providing single-sided reports does not constitute identical double-sided module delivery. Total preparation, fabrication, agreed inspection, packaging, and shipping, then divide by accepted delivery quantity to compare total and per-board costs at equal scope. Use current RFQ amounts and rates rather than assuming a fixed reduction.
Comparison of double-sided IMS board with adjacent board types
Current configuration distinction: circuits on both sides and holes insulated from the metal core form a separate product, more complex than single-sided IMS
- Single-sided insulated copper base high-power LED board — Copper core spreads heat with an insulation layer; it differs from boards with dielectric-free direct thermal paths
Metal substrate complete product catalog · All PCB Products
Double-sided IMS board material and design basis
- Engineering reference | Thermal via design rules: hole-wall copper, filling, and interface contact: structural reference; supplier capacity claims do not transfer
- Engineering reference | Basic PCB design rules: copper weight, spacing, and hole diameter: General manufacturing design method
- Engineering reference | Thermal Clad metal-core PCBs: dielectric thermal-conductivity and insulation selection: material dielectric thickness/ASTM D5470 thermal-conductivity values; the reference stackup is not a manufacturer standard for complete boards
When citing the above materials, record material revisions and design conditions for HPL-06706 on both sides and insulated through-holes; first-article review focuses on two-sided insulation and clearance-hole microsections. If materials, copper weight, or via structure change, update fabrication drawings and inspection items before release.
Request Quote for This PCB Configuration: reference product ID 245, include critical circuits/interfaces and quantity, and identify specifications to retain or adjust.
