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Gold Finger PCB

Specify PCB edge contacts by connector geometry, plating area, thickness and bevel. Separate mating-contact requirements from solderable surface finishes.

Gold-finger PCB fabrication: hard-gold contacts and slot datums

Gold-finger bare-board fabrication requires mating slots, contact lengths, key positions, bevels, and plating drawings. Review durability, contact sequence, and links separately for industrial cards, graded-contact test boards, and M.2. Deliver board-edge dimensions and nickel/gold records; thickness or plating alone does not guarantee mating life.

Comparison of segmented and graded gold fingers

The historical ten-layer TU-872 product lists segmented gold fingers combined with ENIG. Existing graded gold-finger products retain their original structures; contact segmentation, long/short fingers, and contact sequence follow interface drawings, with plating, bevels, and slot fit reviewed separately.

Illustrative PCB detail; not a photograph of a KFPCBA delivery

Ten-layer segmented gold finger PCB →

Convert Slot Drawing to Manufacturing Reference

Provide key positions, bevels, contact lengths, gold-finger areas, and plating requirements. Artwork, plating, and profiling must share the same mechanical datum; contact continuity does not establish contact sequence or mating durability.

Gold finger order: slot and plating map

After selecting a product in this category, submit mating slots, board-edge thickness, key positions, bevels, contact lengths, and plating. Match each change to the Engineering Reference Configuration, using the same revision for fabrication drawings, inspection locations, and material approvals; define specialized verification and report scope before quotation.

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Material and Process Reference

Consult selected PCB configuration

How do hard-gold fingers differ from ENIG PCBs?

Hard-gold contact applications differ from ENIG soldering-surface requirements; both being gold does not establish substitutability. Industrial cards, graded-contact test boards, and M.2 interfaces have different mechanical datums and contact sequences.

How should board thickness, bevels, and contacts be selected for industrial cards and M.2 boards?

Match slots and mating requirements first, then determine board edges and contacts. More gold-plated area does not automatically improve overall system reliability; contact areas, structural fit, and corresponding verification are critical.

Gold-finger PCB pricing and selection FAQ

How much do gold-finger PCBs cost? Can hard gold and ENIG be substituted

A project-specific quotation requires review of the available files, quantity, materials, requested tests, delivery destination, taxes, shipping, and trade terms. This is not a complete finished-product quotation. Base fabrication/sample pricing, special processes, and inspections must not be billed twice. Any formula on this page organizes cost inputs; it is not a quoted rate.View cost items, calculation conditions, and sources.

How should I compare quotations from gold-finger PCB manufacturers?

Check contact-area nickel/gold coverage, slots, and bevels; quotes should match the connector. Gold-plated area or thickness alone cannot establish mating life; define mechanical and plating inspections separately.

Is it reasonable to calculate gold-finger plating costs using the whole board area?

Mark actual contact areas and plating scope before agreeing pricing and inspection criteria. More gold plating does not automatically increase system reliability; areas must match the slot.

Does equal board thickness guarantee compatibility with M.2 or industrial slots?

Also check key positions, bevels, pin sequence, and contact lengths against connector drawings. Similar outlines cannot replace mechanical and electrical compatibility checks.

Can a basic card designed for insertion while powered off be directly converted to hot-swap use?

Contact sequence is only part of the requirements; power current limiting, default signal states, and software recovery also matter. Review structural and system development separately; hard-gold surfaces do not establish live-insertion capability.

Which records must be rechecked when bevels change on a gold-finger repeat order?

Check slot fit, effective contact areas, and board-edge dimensions, synchronizing approved drawings and inspections. Plating records alone cannot establish continued fit after mechanical changes.

Consult Gold Finger PCB for Quotes: describe the application, existing configuration, and expected quantity so we can discuss bare-board fabrication requirements, inspection, and delivery conditions.

How much do gold-finger PCBs cost? Can hard gold and ENIG be substituted

Quotes should separately account for contact-area nickel/gold and area, board-edge thickness, bevels and key positions, contact lengths and sequence, and plating and mechanical inspections. List initial-order setup charges separately from per-batch and per-board charges; for equal quantities, also align revisions, delivery configurations, and tax and freight terms to identify whether price differences reflect configurations or excluded work.

Quotation terms depend on the approved files, quantity, material supply, tests and delivery requirements.

Prepare a structured RFQ or use the short inquiry form.

Quotation ItemsWhat to verify during comparison
Nickel gold contact area and sizeContact area and nickel/gold requirements define plating scope; whole-board ENIG prices cannot replace selective contact-gold plating prices.
Board Edge Thickness, Chamfer, and KeyingBoard thickness, bevels, and key positions correspond to specific slots; special profiling adds fabrication work.
Contact Length and SequenceDesign contact lengths and sequence around maintenance and interface requirements; quotations cannot count only total pins.
Plating and Mechanical InspectionPlating and mechanical dimensions require different inspections; describe sampling and reports separately.

Need a Configuration for Your Project?

Send the materials, quantity, target date, and available files for engineering review. Review quality and acceptance, material responsibility, or use the engineering RFQ when released files are ready.

Send Requirements

Product Configurations

Compare options by material, structure, and application. Each detail page explains the process and verification conditions.

Illustrative configuration for Ten-layer segmented gold finger PCB
Engineering Reference Configuration

Ten-layer segmented gold finger PCB

Define separated contact regions, finger lengths and actual connector mating sequence independently. This illustrative ten-layer configuration does not establish KFPCBA production history, hot-swap function or mating life.

Illustrative layer count
10 layers
Candidate laminate
TU-872; exact grade unverified
Reference feature
Segmented gold-finger contacts
Candidate surface zoning
ENIG soldering regions and separately specified finger gold; thickness and hardness unverified
View Configuration
Illustrative configuration for M.2 Gold Finger PCB Fabrication
Engineering Selection Reference

M.2 Gold Finger PCB Fabrication

Review six-layer M.2 gold-finger PCB fabrication against approved mechanical and interface revisions. Define thickness, keying, selective hard gold, low-loss materials, and link measurements; functional SSD testing is separate.

Material
I-Tera MT40 reference
Structure
6 Layer
Specification
0.80mm Target
Key Requirement
85 Ω differential reference
Selection Focus
M.2 Card Insertion
View Configuration
Illustrative configuration for Stepped gold-finger PCB fabrication
Engineering Selection Reference

Stepped gold-finger PCB fabrication

Stepped gold-finger test boards: review long and short contacts, slot datums, hard-gold targets, and sequencing tests. All values are illustrative; approve fabrication drawings and acceptance criteria before ordering. Assembly and system verification require separate scope.

Material
FR4 Reference
Structure
4 Layer
Specification
1.20mm Target
Key Requirement
Hard Gold Au1.27 µm Target
Selection Focus
Stepped contact sequence
View Configuration
Illustrative configuration for Industrial gold finger PCB fabrication
Engineering Selection Reference

Industrial gold finger PCB fabrication

Industrial gold-finger boards: review mating-slot geometry, selective hard gold, bevels, and contact-resistance tests. All values are illustrative; approve fabrication drawings and acceptance criteria before ordering. Assembly and system verification require separate scope.

Material
370HR
Structure
8 Layer
Specification
1.60mm Target
Key Requirement
Hard Gold Au0.76 µm Target
Selection Focus
Industrial Card
View Configuration
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