Company Address
201, Factory 6, Longhui Industrial Park, Fuqiao 3rd District, Xinhe Community, Fuhai Street, Baoan District, Shenzhen, Guangdong, China

Rogers PCB

Compare Rogers PCB material grades and construction options. Specify the exact laminate, copper, dielectric thickness and RF acceptance requirements.

Rogers PCBs: material families and dedicated structures

Rogers bare PCB procurement requires specific grades, bonding layers and hole types. Select the thermoset, PTFE or high-Dk material system against the transmission, antenna, resonant or coupling requirements. Review the affected models before approving a material substitution, then confirm the layer table and geometric inspection records. A brand name alone does not define a standard board construction.

Rogers grades do not share one fabrication route

Review fabrication and hole-structure routes separately for RO4000 thermosets, RT/duroid PTFE, and TMM dielectrics. Alternative materials require remodeling against circuit targets; similar Dk alone does not justify swapping materials in procurement lists.

Rogers fabrication: grades, bonding layers, and hole drawings

After selecting a product in this category, submit the specific grade revision, cores and bonding layers, pressed dielectric thickness, and hole types. Match each change to the Engineering Reference Configuration, using the same revision for fabrication drawings, inspection locations, and material approvals; define specialized verification and report scope before quotation.

Adjacent direction:High-frequency material and band products · Functionally layered mixed lamination product · Custom Rogers structure products · RF functional products

Material and Process Reference

Consult selected PCB configuration

Can RO4350B, RO3010, TMM10i, and 5870 be directly substituted?

RO4350B, RO3010, TMM10i, and 5870 have different dielectric properties and material systems. Quotes should compare usable structures for the same circuit targets; substituting a cheaper grade into unchanged artwork may change impedance and electrical length.

How should a Rogers grade be selected using dielectric models, thickness, and circuit requirements?

High-Dk materials help size certain structures, while low-Dk materials serve different feedline and radiating structures. Check suitability using approved material models and geometry before selecting grade and thickness.

Rogers PCB pricing and selection FAQ

How should Rogers PCB prices be compared? Can different grades be substituted

A project-specific quotation requires review of the available files, quantity, materials, requested tests, delivery destination, taxes, shipping, and trade terms. Add any specified processes and tests not yet included to the batch budget; these prices do not apply to other materials or layer sequences. Any formula on this page organizes cost inputs; it is not a quoted rate.View cost items, calculation conditions, and sources.

How should I compare quotations from Rogers PCB manufacturers?

Specify grade and thickness in the quote and confirm hole, lamination, and geometric requirements. Different grades change electrical length and structure; compare board prices only after checking suitability, rather than directly replacing the original material with a cheaper grade.

Can RO4350B and RO4003C be directly interchanged because they belong to the same series?

Check model, dielectric thickness, copper, and applicable data item by item; approve RF geometry and processes after review. A shared series name does not establish equivalence with the original artwork or stock availability.

Do I need complete supply specifications when procuring Rogers materials?

List grade, thickness, copper foil, and revision, with manufacturing confirming the actual selection and alternatives. Specifying only a brand allows different quotations to use different structures.

Are high-Dk materials always better for small antennas?

Miniaturization is also constrained by bandwidth, loss, radiation, and installation. Compare approved models and actual geometry; do not purchase materials based only on Dk magnitude.

Which tasks should be separated in PTFE and ceramic-filled material quotations?

Different material systems require separate confirmation of hole, lamination, surface, and other manufacturing conditions. Itemize materials, engineering adaptation, and specified inspections; a cheaper grade does not imply a lower project cost.

Request a Rogers PCB quotation: describe the application, existing configuration, and expected quantity so we can discuss bare-board fabrication requirements, inspection, and delivery conditions.

How should Rogers PCB prices be compared? Can different grades be substituted

Quotes should separately account for RO4000, PTFE, or ceramic-filled materials, dielectric thickness and copper foil, hole fabrication, lamination and surface finish, and port or geometric inspections. List initial-order setup charges separately from per-batch and per-board charges; for equal quantities, also align revisions, delivery configurations, and tax and freight terms to identify whether price differences reflect configurations or excluded work.

Quotation terms depend on the approved files, quantity, material supply, tests and delivery requirements.

Prepare a structured RFQ or use the short inquiry form.

Quotation ItemsWhat to verify during comparison
RO4000, PTFE, or ceramic-filled materialsDifferent material systems and grades are different procurement items; compare usable structure prices after aligning circuit targets.
Dielectric Thickness and Copper FoilDielectrics and copper foil change trace geometry and material combinations; matching nominal board thickness alone is insufficient.
Drilling, lamination, and surface treatmentHole and lamination routes vary with the specific structure; quotes should match the hole table and stackup.
Port or Geometric InspectionList specified port geometry and tolerance inspections separately; bare-board checks do not automatically include active RF testing.

Need a Configuration for Your Project?

Send the materials, quantity, target date, and available files for engineering review. Review quality and acceptance, material responsibility, or use the engineering RFQ when released files are ready.

Send Requirements

Product Configurations

Compare options by material, structure, and application. Each detail page explains the process and verification conditions.

Illustrative configuration for TMM10i PCB fabrication
Engineering Selection Reference

TMM10i PCB fabrication

Review TMM10i resonant-filter PCB fabrication against approved band, resonator, and coupling-gap requirements. Define finished copper, tuning state, material-specific processing, and optional VNA measurements.

Material
TMM10i
Structure
2 Layer
Specification
1.270mm Dielectric
Key Requirement
High Dk Resonance
Selection Focus
Immersion silver
View Configuration
Illustrative configuration for Rogers 5870 PCB fabrication
Engineering Selection Reference

Rogers 5870 PCB fabrication

Review RT/duroid 5870 directional-coupler PCB fabrication. Define coupled-line geometry, PTFE hole processing, finished copper, port numbering, terminations, and optional coupling, isolation, and directivity measurements.

Material
RT/duroid 5870
Structure
2 Layer
Specification
0.508mm dielectric
Key Requirement
Four-Port Coupling
Selection Focus
Immersion silver
View Configuration
Illustrative configuration for RO3010 antenna PCB fabrication
Engineering Selection Reference

RO3010 antenna PCB fabrication

RO3010 antenna PCB fabrication reviews materials, structures, and deliverables against radiating-patch geometry and high-Dk substitutions, with cost breakdowns, one-time setup and same-revision reorder boundaries, selection steps, and quotation conversion methods. Specifications follow approved fabrication drawings; component assembly and complete-system verification are separate.

Material
RO3010
Structure
2 Layer
Specification
0.635mm dielectric
Key Requirement
High Dk Antenna
Selection Focus
Immersion silver
View Configuration
Illustrative configuration for Four-layer RO4350B PCB fabrication
Engineering Selection Reference

Four-layer RO4350B PCB fabrication

Four-layer RO4350B PCB fabrication reviews materials, structures, and deliverables against specialty-dielectric layer sequences and ground-connection holes, with cost breakdowns, one-time setup and same-revision reorder boundaries, selection steps, and quotation conversion methods. Specifications follow approved fabrication drawings; component assembly and complete-system verification are separate.

Material
RO4350B+RO4450F
Structure
4 Layer
Specification
1.02mm Target
Key Requirement
50 Ω Single-Ended
Selection Focus
Fully Custom Dielectric
View Configuration
PCB / PCBA · PROJECT ENQUIRY

Does Your Project Need PCB Fabrication, Assembly, or Box Build?

Tell us the product use and which files are available. We can define the next engineering step even when the data package is not complete.

Call UsWhatsAppRequest a Quote