Engineering Selection Reference
370HR PCB: six-layer 370HR isolation-board fabrication review
Six-layer 370HR isolation-board fabrication requires current-drawing review. Six-layer 370HR bare control boards need all-layer copper keep-outs, slot scope, and PTH/NPTH drawings. Greater thickness adds hole-plating/soldering heat requirements; Tg is not operating temperature. Deliver slot clearances, hole-wall copper, and netlists; itemize insulation tests by voltage, duration, and leakage criteria.
370HR PCB work first requires defined prototype or production scope. Provide Gerber data, drill files, board outline, and layer stackup, materials/processes, quantities, and acceptance requirements. Thicker six-layer isolation structure with 370HR; Tg is a material value, not continuous operating temperature
Six-layer 370HR isolation-board review first checks 370HR material and NPTH isolation slots. Quotations also need layer-specific isolation boundaries/mounting-hole categories. Subsequent tables link design targets to inspections.
Why select this 370HR isolation structure?
For industrial isolated I/O requiring thermal, mechanical-stiffness, and isolation review, start with six-layer 2.00mm 370HR. The thicker body supports through-hole components/terminals using a verified manufacturer grade; slots/copper keep-outs distinguish this product.
What does 370HR high-Tg PCB fabrication pricing include?
Six-layer isolated I/O costs comprise 370HR, the 2.00mm reference body, 70µm outer-copper target, terminal holes, NPTH slots, and inspections. Thermal material reliability and insulation acceptance are separate. Specify actual materials/test conditions, beyond TG high-temperature labels. Compare HASL and selective fine-pitch ENIG against assembly needs.
Quotation terms depend on the approved files, quantity, material supply, tests and delivery requirements.
Prepare a structured RFQ or use the short inquiry form.
Enter the following items in one itemized quotation: specify cost units and tax/shipping basis, with separate columns for first orders and same-revision repeat orders. The table is a procurement breakdown method, not a ready-made price list; reference specifications require approval against current fabrication drawings.
| Quotation items and scope | Inputs to confirm for this configuration | Same-revision reorders and changes |
|---|---|---|
| Materials/fabrication, quoted per batch or accepted board | Isola 370HR FR4; 6 layers; inner base copper 35µm; outer base 35µm/finished target 70µm | Recurs on repeat orders; material, layer-order, or copper-weight changes require requotation |
| Holes and forming, per approved hole table | Ø0.40mm finished through holes; nonplated milled isolation slots | Same-revision reorders; review processes before through-stack isolation changes |
| Surface finish/packaging, noting areas and batches | Lead-free HASL; optional ENIG in fine-pitch regions | Incurred by actual batch; confirm packaging, storage conditions, and surface-finish substitutions separately |
| Engineering/tooling preparation, identifying one-time or per-batch charges | Through-stack isolation: submit six-layer copper keep-outs/slot scope; determine whether all inner layers follow identical boundaries. | Verify file revisions, ownership, and storage condition before reusing old tooling; do not assume reuse is free |
| Structural/special inspections, identifying coupons, hole groups, or samples | Agree slot/clearance inspection and netlist isolation; provide complete withstand-voltage conditions separately. Identify PTH/NPTH in hole tables; deliver critical positions/diameters. | List initial prototype validation and per-batch sampling separately; quote per-board requirements separately rather than assuming everything is completed once |
| Delivery scope, reports, and accepted quantity | Bare isolation-control PCBs, isolation-domain drawings, material lots, slot/hole dimensions, and order-required electrical/insulation records. | Retain revision links and batch records on repeat orders; list component assembly, firmware, and complete-unit testing separately |
How does 370HR high-TG differ from ordinary FR4?
FR4 is a material class; 370HR is a specified grade. Compare thermal indicators/conditions in corresponding documentation instead of claiming high TG never deforms. Industrial I/O also needs isolation layout, terminal mechanics, and soldering verification; high TG does not replace creepage/system-insulation requirements.
| Comparison Dimension | 370HR high-Tg PCB fabrication | BMS Battery Management PCB Fabrication |
|---|---|---|
| Material and Grade | Isola 370HR FR4 | Historical: TG170, grade unlisted; procurement reference: Shengyi S1000-2M, not the historical grade |
| Layer Count and Structure | 6 Layer | 6 Layer Through-Hole Board |
| Hole Structure and Dimensions | Ø0.40mm finished through holes; nonplated milled isolation slots | Through holes are the historical structure; Ø0.30mm is a reference design target |
| Application | Industrial isolated I/O; control supplies in hot environments | BMS cell-voltage acquisition; battery-management control |
How should high-TG thickness and long-term operating temperature be selected?
Tg is a material test result; typical 180℃ is not continuous operating temperature. Define thermal environments/soldering first, then hole aspect ratio, dielectrics, and insulation. Added thickness changes mechanics but complicates drilling/plating; select the 2.00mm reference with terminals/hole sizes.
| Review step | Project inputs | Reviewable output |
|---|---|---|
| 1 Define use and scope | Submit six-layer copper keep-outs/slot scope; determine whether inner layers follow identical isolation boundaries. | Agree slot/clearance inspection and netlist isolation; provide complete withstand-voltage conditions separately. |
| 2 Confirm structural requirements | Distinguish chassis grounding from insulated mounting holes to determine plating. | Identify PTH/NPTH in hole tables; deliver critical positions/diameters. |
| 3 Match signal nets to fabrication targets | No default impedance for low-speed isolated I/O; group high-speed nets separately if needed | Provide nets, layer pairs, and verification scope; review with Ø0.40mm finished through holes and nonplated milled isolation slots |
| 4 Confirm quotation and approved revision | Isola 370HR FR4; 2.00mm reference target; lead-free HASL; optional fine-pitch ENIG | Request quotations using material/pattern/inspection lists at the same revision; list unapproved substitutions as separate alternatives rather than including them in the baseline quotation |
370HR isolation board manufacturing specifications
| Specification | Reference configuration or target |
|---|---|
| Material and Grade | Isola 370HR FR4 |
| Layer Count and Structure | 6 Layer |
| Total Board Thickness | 2.00mm reference target |
| Dielectric thickness and interlayer relationship | Outer signal-to-ground spacing 0.20mm; inner copper must not shorten creepage between isolation domains |
| Base Copper and Finished Copper | Inner base copper 35µm; outer base 35µm/finished target 70µm |
| Hole Structure and Dimensions | Ø0.40mm finished through holes; nonplated milled isolation slots |
| Trace Width and Spacing | 0.20/0.20mm reference design; isolation clearances separately calculated for product safety requirements |
| Impedance Target and Measurement Methods | No default impedance for low-speed isolated I/O; group high-speed nets separately if needed |
| Surface Finish | Lead-free HASL; optional ENIG in fine-pitch regions |
| Manufacturer material data | 370HR: Tg 180℃, manufacturer typical DSC/IPC-TM-650 2.4.25C value; not long-term operating temperature |
| Application | Industrial isolated I/O; control supplies in hot environments |
| Deliverables | Bare isolation-control PCBs, isolation-domain drawings, material lots, slot/hole dimensions, and order-required electrical/insulation records. |
370HR material Tg and thermal process
370HR Tg 180℃ uses manufacturer typical DSC/IPC-TM-650 2.4.25C data. Retain lots/test methods with selection records. Drawings/project tests separately define working voltage, temperature environment, slot widths, and hole-wall copper.
Material Tg versus long-term operating temperature
370HR Tg is a typical material value, not continuous equipment temperature. Added thickness raises hole aspect ratio without automatically improving electrical safety. Define creepage, clearance, and insulation verification by actual voltages/pollution environments.
All-layer copper keep-outs, slot burrs, and terminal thermal connections: manufacturing checks
NPTH isolation slots must have no copper/burr bridges; clearly show inner-layer keep-outs on both sides. Confirm large-terminal thermal connections with 70µm finished copper to prevent thermal mass from impairing soldering or test contact.
Slot clearances and complete insulation-test conditions: acceptance items
Bare-board electrical tests cover isolation nets; inspect slot widths, copper-to-slot spacing, and hole-wall microsections. Necessary withstand-voltage/insulation-resistance tests specify voltage, hold time, leakage, and criteria. Material names do not establish default safety compliance.
370HR isolation board delivery scope
Applications: industrial isolated I/O; control supplies in hot environments.
Bare isolation-control PCBs, isolation-domain drawings, material lots, slot/hole dimensions, and order-required electrical/insulation records.
Layer-specific isolation boundaries and mounting-hole categories: quotation inputs
Submit isolation boundaries/hole categories to convert targets into inspectable drawings. Inputs determine artwork, material, or structural scope; quotations freeze with approved drawings.
| Required project inputs | Engineering Decisions Affected | Records/delivery as agreed in the order |
|---|---|---|
| All-layer isolation boundaries | Submit six-layer copper keep-outs/slot scope; determine whether inner layers follow identical isolation boundaries. | Agree slot/clearance inspection and netlist isolation; provide complete withstand-voltage conditions separately. |
| Industrial Mounting Holes | Distinguish chassis grounding from insulated mounting holes to determine plating. | Identify PTH/NPTH in hole tables; deliver critical positions/diameters. |
370HR high-Tg PCB fabrication: pricing, selection, and procurement FAQs
What does 370HR high-Tg PCB fabrication pricing include?
A project-specific quotation requires review of the available files, quantity, materials, requested tests, delivery destination, taxes, shipping, and trade terms. Add specified materials, processes, and inspections not yet included to the total cost. Standard board references do not cover every configuration of this product. Any formula on this page organizes cost inputs; it is not a quoted rate.View cost items, calculation conditions, and sources.
How does 370HR high-TG differ from ordinary FR4?
FR4 is a class; 370HR is a grade. Compare thermal metrics using corresponding documentation/conditions. High Tg does not replace terminal mechanics, soldering, or creepage design. Check slots/keep-outs by actual voltages/environments; never-deforms claims are unsupported. View Specific Comparison Basis
How should high-TG thickness and long-term operating temperature be selected?
Material Tg is not continuous equipment temperature; typical 180℃ cannot become a sustained-temperature specification. Thickness affects aspect ratio/assembly. Provide thermal/soldering and terminal-mechanical requirements before checking materials, holes, and insulation. View Specific Comparison Basis
Can high-TG boards directly guarantee withstand-voltage acceptance?
No. Voltage, dielectrics, all-layer keep-outs, slots, and environments also matter. Specify electrodes, voltage, duration, and leakage criteria in orders, then judge actual records.
Can 370HR be replaced with other TG180 materials in quotations?
Equal Tg does not establish identical parameters, foil, or fabrication. Review exact grades/design conditions and retain approved revisions; do not silently insert candidates into BOMs.
Why inspect isolation-slot burrs and inner copper?
Burrs or insufficient inner-copper clearance can compromise boundaries. Slot width, copper spacing, and netlists must match drawings; a visible slot does not establish correctness on every layer.
Must each inner layer's keep-outs be checked on high-Tg isolation boards?
Check each boundary against actual six-layer drawings; outer slots do not prove inner clearance. Itemize slot/clearance, isolation-netlist, and PTH/NPTH checks; define withstand-voltage conditions separately. Typical Tg is not whole-board continuous temperature.
How are per-board and per-panel 370HR high-TG PCB quotations converted?
Panel six-layer keep-outs, NPTH slots, and PTH chassis grounds using the same hole-table revision; process-rail copper must not cross isolation domains. State finished quantities per panel, purchased panels, and delivery format. Divide actual panel costs by accepted quantity; itemize setup, inspections, and packaging. Utilization does not guarantee yield.
How are first-order one-time costs separated from 370HR high-TG PCB reorder costs?
Confirm through-stack isolation/industrial mounting documentation first; identify one-time engineering/tool/test charges. Agree slot/clearance/netlist isolation, with separate complete withstand-voltage conditions. Confirm files/ownership before reuse. Current materials, fabrication, and inspections remain chargeable; list repeated setup separately instead of old totals.
Can I obtain a 370HR high-TG PCB budget before through-stack isolation documentation is complete?
Provide applications, outlines, quantities, and drawings for an estimate identifying gaps. Formal review needs six-layer keep-outs/slot scope and matching inner-layer boundaries. Agree slot/clearance/netlist isolation and separate withstand-voltage conditions. Confirm pricing after freeze; initial inquiries need not contain every file, but estimates exclude undefined structures.
What requires reconfirmation when 370HR high-TG PCB reorders change materials, holes, or mounting?
Distinguish chassis grounds/insulated holes to determine plating. Identify PTH/NPTH and deliver critical position/diameter records. Match changes against previous material/hole/mechanical files to determine drawing/process revisions or remeasurement. Names/layer counts alone do not establish identical conditions.
What configurations should be compared when two 370HR high-TG PCB quotations use identical materials?
Check 370HR grade and copper/slot structures, then all-layer isolation and withstand-voltage conditions. Typical Tg180℃ is not continuous operating temperature; equal-Tg candidates are not automatically interchangeable.
Which reports must link to board numbers before 370HR high-TG PCB samples enter production?
Agree slot/clearance/netlist isolation with separate complete withstand-voltage conditions. Identify PTH/NPTH and deliver critical hole records. Link lots, files, and results to sample numbers; production uses issue-closed revisions. Old reports support comparison, not current inputs. Define uncovered system scope separately.
How can lower small-batch 370HR high-TG PCB unit prices be checked against total costs?
Compare HASL/selective ENIG on identical isolation drawings, adding agreed slot/hole/withstand-voltage checks. Equal-Tg substitutions still need approval before savings claims. Sum setup, fabrication, inspections, packaging/shipping and divide by accepted quantity. Use current rates; assume no fixed reduction.
370HR isolation versus related board types
Current distinction: thicker six-layer isolation structure with 370HR; Tg is a material value, not continuous operating temperature
- Six-layer TG170 BMS battery-management board — Confirm materials and layer-by-layer copper weight against current fabrication files
- Twelve-layer TG170 AR/VR mainboard — Historical twelve-layer through-hole structure supporting multi-interface mainboards through layer count and power/ground allocation
High TG PCB complete product catalog · All PCB Products
370HR isolation-board material and design basis
- Engineering reference | Isola 370HR material: high Tg and frequency-dependent parameters: Published manufacturer material data
- Engineering reference | Basic PCB design rules: copper weight, spacing, and hole diameter: General manufacturing design method
When citing these sources, record revisions/conditions for 370HR and NPTH isolation slots. First-article checks emphasize clearances/complete insulation conditions. Update drawings/inspections before material, copper, or hole changes.
Request Quote for This PCB Configuration: Reference product ID 339, attach critical circuits/interfaces and quantities, and identify specifications to retain or adjust.
Historical data and current manufacturing requirements
Material abbreviations and copper-weight shorthand in historical records do not form complete fabrication definitions. Do not infer material grades, locations, or performance from them or interpret them as finished copper weight on every layer. For current RFQs, provide approved stackups and material lists, identifying base and finished copper layer by layer.
